New Type Low Temperature Lead-free Syringe smd Solder Paste Flux For Soldering Led Sn42Bi58 Repair Welding paste tool

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Brand Name KEK

Origin CN(Origin)

Model Number 4258/6337

Certification RoHS

Particle Size 20-38μm

Weight

15g

35g

Color

Sn4258-138

Sn6337-183

Sn42Bi58：Lead-free low temperature solder paste，Melting point: 138°C

LED type special non-high temperature resistant board is used, general products are not recommended.

Sn6337：Ledium temperature solder paste，Melting point: 183°C

Suitable for basic PCB component maintenance,IC,SMD, more commonly used.

Need to pay attention when using

To work in a ventilated environment

Avoid frequent skin contact，If it gets on the skin, wipe it with alcohol and rinse with water

Do not touch sensitive parts

Tun sie wollen eine solder paste, dass schmilzt und schweißnähte fest bei niedriger temperatur? Spritze typ niedrigen temperatur lotpaste ist geeignet für sie!

Hauptmerkmale

Spritze typ low-temperatur lotpaste ist installiert in die spritze, die ist einfach zu verteilen und verwenden. Die haltbarkeit ist 6 monate bei raum temperatur.

Apply evenly

Press the needle tube as needed to push out the solder paste and distribute it evenly. There will be no excess and excess solder paste.

superior quality

High-end-qualität, eine einzigartige formel, perfekte leistung, leicht zu schweißen, solder joint ist hell und voll, keine schweißnaht, falsche schweißen phänomen.

Die rückstände ist farblos und transparent, hat keinen einfluss auf die erkennung, einweg und ausgezeichnete reinigung leistung.

which is suitable for basic PCB component maintenance, mobile phone maintenance, etc. It is an ideal choice for you to install various electronic components and small circuit board parts.

Description:

What is the solder tin paste?

1. Solder tin paste is a new type of solder material that comes with SMT.

2. Solder paste is a complex system that is made of a paste of solder powder, flux, and other additives.

3. At the normal temperature, the solder tin paste has a certain viscosity, and the electronic component can be initially adhered to a predetermined position.

4. At the soldering temperature, the soldered component and the printed circuit pad are soldered together(Permanent connection.) with the evaporation of the solvent and some additives.